Component-Wise Power Estimation of Electrical Devices Using Thermal Imaging

Herglotz C, Grosche S, Bharadwaj A, Kaup A (2021)

Publication Type: Journal article

Publication year: 2021

Journal

IEEE Transactions on Consumer Electronics Institute of Electrical and Electronics Engineers (IEEE)

Book Volume: 67

Pages Range: 383-392

Journal Issue: 4

URI: http://arxiv.org/abs/2307.08354

DOI: 10.1109/TCE.2021.3122076

Abstract

This paper presents a novel method to estimate the power consumption of distinct active components on an electronic carrier board by using thermal imaging. The components and the board can be made of heterogeneous material such as plastic, coated microchips, and metal bonds or wires, where a special coating for high emissivity is not required. The thermal images are recorded when the components on the board are dissipating power. In order to enable reliable estimates, a segmentation of the thermal image must be available that can be obtained by manual labeling, object detection methods, or exploiting layout information. Evaluations show that with low-resolution consumer infrared cameras and dissipated powers larger than 300 mW, mean estimation errors of 10% can be achieved.

Authors with CRIS profile

Christian Herglotz Lehrstuhl für Multimediakommunikation und Signalverarbeitung Simon Grosche Lehrstuhl für Multimediakommunikation und Signalverarbeitung Akarsh Bharadwaj Lehrstuhl für Multimediakommunikation und Signalverarbeitung Andre Kaup Lehrstuhl für Multimediakommunikation und Signalverarbeitung

How to cite

APA:

Herglotz, C., Grosche, S., Bharadwaj, A., & Kaup, A. (2021). Component-Wise Power Estimation of Electrical Devices Using Thermal Imaging. IEEE Transactions on Consumer Electronics, 67(4), 383-392. https://dx.doi.org/10.1109/TCE.2021.3122076

MLA:

Herglotz, Christian, et al. "Component-Wise Power Estimation of Electrical Devices Using Thermal Imaging." IEEE Transactions on Consumer Electronics 67.4 (2021): 383-392.

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