Examining Ag-Ag Direct Bonding on Chemically Coated DBC Substrates as a Pasteless Die-Attach Approach

Häußler F, Schöttner J, Schubert J, Muckelbauer M, Spiecker E, Franke J (2021)

Publication Language: English

Publication Type: Conference contribution, Conference Contribution

Publication year: 2021

Publisher: VDE

City/Town: Berlin

Pages Range: 1-8

Event location: Nürnberg DE

ISBN: 978-3-8007-5515-8

URI: https://ieeexplore.ieee.org/document/9472281

Abstract

In this paper Ag-Ag direct bonding as a pasteless high temperature die-attach technology for power electronic applications on ceramic substrates is examined as conceivable alternative to silver sintering. To this end, sputtered Ag metallization on silicon chips and chemically coated direct bonded copper (DBC) substrates were bonded with varying parameters using design of experiments. Factors were pressure, bonding time and surface treatment. For the best parameter set average die-shear strengths of 29 MPa (out of 4 samples) have been reached processing non-polished silver coated DBC substrates at 250deg C with 20 MPa pressure and 60 minutes of process time. Microsections and images from a scanning acoustic microscopy (SAM) showed connected and non-connected areas at the joining interface. Lower shear strengths were found for polished surfaces than for the non-polished counterparts. By scanning electron microscopy (SEM) analysis the diffusion-based development of solid interconnection was confirmed, demonstrating feasibility of Ag-Ag direct bonding on grinded DBCs. The overall results affirm the viability and point out challenges of this die-attach process.

Authors with CRIS profile

Felix Häußler Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jakob Schöttner Chair of Engineering Design Johanna Schubert Lehrstuhl für Werkstoffwissenschaften (Mikro- und Nanostrukturforschung) Martin Muckelbauer Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Erdmann Spiecker Lehrstuhl für Werkstoffwissenschaften (Mikro- und Nanostrukturforschung) Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

How to cite

APA:

Häußler, F., Schöttner, J., Schubert, J., Muckelbauer, M., Spiecker, E., & Franke, J. (2021). Examining Ag-Ag Direct Bonding on Chemically Coated DBC Substrates as a Pasteless Die-Attach Approach. In VDE (Eds.), Proceedings of the PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management (pp. 1-8). Nürnberg, DE: Berlin: VDE.

MLA:

Häußler, Felix, et al. "Examining Ag-Ag Direct Bonding on Chemically Coated DBC Substrates as a Pasteless Die-Attach Approach." Proceedings of the PCIM Europe digital days 2021; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Management, Nürnberg Ed. VDE, Berlin: VDE, 2021. 1-8.

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