Evaluation of detatchable board-to-board interconnects on screen printed electronic structures
Schirmer J, Huemmer M, Klauss M, Neermann S, Reichenberger M, Franke J (2021)
Publication Type: Journal article
Publication year: 2021
Journal
Book Volume: 6
Journal Issue: 3
Abstract
Hybrid printed electronics (HPE) combines advantages of conventional electronics manufacturing technologies such as surface mount technology with those of printed electronics in order to realize more complex electronic systems. To realize the final product, such HPE subassemblies have to be connected to higher-level assemblies. So far interconnection techniques for the so-called level 3 interconnection between printed subsystems and standard electronics have not yet been considered adequately in scientific research. In this paper, alternative detachable level 3 interconnection technologies, i.e. spring loaded contact pins, zero insertion force (ZIF) as well as Non-ZIF connectors are investigated systematically regarding their electrical behaviour against the background of printed electronics. Screen-printed silver filled polymer thick film paste is used to realize printed conductor patterns on flexible polymer substrates, which are connected later on with the alternatives mentioned above. Transition resistance is measured using the four wire method as produced, after repeated mating cycles as well as after accelerated aging tests. The various electrical contacts are subjected to thermal stress in temperature cycling testing and during aging at a constant high temperature. As a result it can be stated, that the sping-loaded contact pins used in this investigation show superior behavior compared with the selected connectors in terms of resistance increase after mating cycles. Concerning long-term behavior after thermal cyling and high temperature storage, all investigated alternaives reveal convincing results.
Authors with CRIS profile
Simone Neermann
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Jörg Franke
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Involved external institutions
Germany (DE)How to cite
APA:
Schirmer, J., Huemmer, M., Klauss, M., Neermann, S., Reichenberger, M., & Franke, J. (2021). Evaluation of detatchable board-to-board interconnects on screen printed electronic structures. Flexible and Printed Electronics, 6(3). https://dx.doi.org/10.1088/2058-8585/ac1fd5
MLA:
Schirmer, Julian, et al. "Evaluation of detatchable board-to-board interconnects on screen printed electronic structures." Flexible and Printed Electronics 6.3 (2021).
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