Grain boundary mediated plasticity: A blessing for the ductility of metallic thin films?

Liebig JP, Mackovic M, Spiecker E, Göken M, Merle B (2021)


Publication Type: Journal article, Original article

Publication year: 2021

Journal

Book Volume: 215

Article Number: 117079

URI: https://www.sciencedirect.com/science/article/pii/S1359645421004596/pdfft?isDTMRedir=true&download=true

DOI: 10.1016/j.actamat.2021.117079

Abstract

The limited ductility of metallic thin films (< 1%) poses a challenge to MEMS and flexible electronics applications. Here, we report on freestanding gold specimens with the remarkable ability to accommodate ≥10% plastic deformation while retaining a high strength. Using in situ nanomechanical testing in a transmission electron microscope, this exceptionally high ductility is traced back to the combination of an ultrathin thickness, a columnar microstructure and a (111) fiber texture. Under such conditions, the deformation is largely mediated by grain boundaries through grain boundary sliding and shear coupled grain boundary migration. Because these non-conventional mechanisms preserve the cross-sectional thickness of the specimens, necking is postponed and the samples can reach a high ductility. Since the mechanisms were evidenced at room temperature and under strain-rate conditions typical of most applications, the findings open up promising outlooks for developing ductile metallic films by microstructural engineering.

Authors with CRIS profile

Additional Organisation(s)

Related research project(s)

How to cite

APA:

Liebig, J.P., Mackovic, M., Spiecker, E., Göken, M., & Merle, B. (2021). Grain boundary mediated plasticity: A blessing for the ductility of metallic thin films? Acta Materialia, 215. https://dx.doi.org/10.1016/j.actamat.2021.117079

MLA:

Liebig, Jan Philipp, et al. "Grain boundary mediated plasticity: A blessing for the ductility of metallic thin films?" Acta Materialia 215 (2021).

BibTeX: Download