The 2021 flexible and printed electronics roadmap

Bonnassieux Y, Brabec C, Cao Y, Carmichael TB, Chabinyc ML, Cheng KT, Cho G, Chung A, Cobb CL, Distler A, Egelhaaf HJ, Grau G, Guo X, Haghiashtiani G, Huang TC, Hussain MM, Iniguez B, Lee TM, Li L, Ma Y, Ma D, McAlpine MC, Ng TN, Österbacka R, Patel SN, Peng J, Peng H, Rivnay J, Shao L, Steingart D, Street RA, Subramanian V, Torsi L, Wu Y (2021)

Publication Type: Journal article, Review article

Publication year: 2021

Journal

Book Volume: 6

Article Number: 023001

Journal Issue: 2

DOI: 10.1088/2058-8585/abf986

Abstract

This roadmap includes the perspectives and visions of leading researchers in the key areas of flexible and printable electronics. The covered topics are broadly organized by the device technologies (sections 1–9), fabrication techniques (sections 10–12), and design and modeling approaches (sections 13 and 14) essential to the future development of new applications leveraging flexible electronics (FE). The interdisciplinary nature of this field involves everything from fundamental scientific discoveries to engineering challenges; from design and synthesis of new materials via novel device design to modelling and digital manufacturing of integrated systems. As such, this roadmap aims to serve as a resource on the current status and future challenges in the areas covered by the roadmap and to highlight the breadth and wide-ranging opportunities made available by FE technologies.

Authors with CRIS profile

Involved external institutions

University of Washington United States (USA) (US) York University Canada (CA) Columbia University United States (USA) (US) Hewlett-Packard Company United States (USA) (US) South China University of Technology (SCUT) / 华南理工大学 China (CN) University of California United States (USA) (US) Sungkyunkwan University (SKKU) Korea, Republic of (KR) IMECAS Institute of Microelectronice of Chinese Academy of Sciences China (CN) Fudan University / 复旦大学 China (CN) University of Chicago United States (USA) (US) University of Minnesota (UMN) United States (USA) (US) University of Windsor (UWindsor) Canada (CA) University of Bari Aldo Moro / Università degli Studi di Bari Aldo Moro Italy (IT) École Polytechnique Fédérale de Lausanne (EPFL) Switzerland (CH) Hong Kong University of Science and Technology (HKUST) / 香港科技大學 China (CN) Bayerisches Zentrum für Angewandte Energieforschung e.V. (ZAE Bayern) Germany (DE) Korea Institute of Machinery and Materials (KIMM) Korea, Republic of (KR) Åbo Akademi University Finland (FI) Universitat Rovira i Virgili (URV) Spain (ES) École Polytechnique - Université Paris-Saclay France (FR) Shanghai Jiao Tong University / 上海交通大学 China (CN) Northwestern University United States (USA) (US) King Abdullah University of Science and Technology (KAUST) / جامعة الملك عبد الله للعلوم و التقنية Saudi Arabia (SA)

How to cite

APA:

Bonnassieux, Y., Brabec, C., Cao, Y., Carmichael, T.B., Chabinyc, M.L., Cheng, K.T.,... Wu, Y. (2021). The 2021 flexible and printed electronics roadmap. Flexible and Printed Electronics, 6(2). https://dx.doi.org/10.1088/2058-8585/abf986

MLA:

Bonnassieux, Yvan, et al. "The 2021 flexible and printed electronics roadmap." Flexible and Printed Electronics 6.2 (2021).

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