Planar Semiconductor THz Antennas Using Spoof Plasmons for Surface Sensing

Bettenhausen M, Römer F, Witzigmann B, Flesch J, Piehler J, You C, Kazmierczak M, Guha S, Capellini G, Schröder T (2018)

Publication Type: Conference contribution

Publication year: 2018

Journal

IEEE MTT-S International Microwave Symposium Digest Institute of Electrical and Electronics Engineers

Publisher: Institute of Electrical and Electronics Engineers Inc.

Book Volume: 2018-June

Pages Range: 236-239

Conference Proceedings Title: IEEE MTT-S International Microwave Symposium Digest

Event location: Philadelphia, PA US

ISBN: 9781538650677

DOI: 10.1109/MWSYM.2018.8439175

Abstract

Spoof surface plasmons are bound electromagnetic modes that are formed on corrugated metal surfaces. In particular for Teraheartz operating frequencies they allow subwavelength electromagnetic confinement. Their dispersion relation can be controlled by their geometric parameters of subwavelength grooves. In this letter a novel semiconductor design for spoof plasmons with patterned doping and a planar surface is presented. This design shows a higher field confinement and sensitivity compared to a plasmonic semiconductor with constant doping or metallic spoof plasmons.

Authors with CRIS profile

Bernd Witzigmann

Involved external institutions

Leibniz-Institut für innovative Mikroelektronik / IHP GmbH - Innovations for High Performance Microelectronics DE Germany (DE) Universität Osnabrück DE Germany (DE) Universität Kassel DE Germany (DE)

How to cite

APA:

Bettenhausen, M., Römer, F., Witzigmann, B., Flesch, J., Piehler, J., You, C.,... Schröder, T. (2018). Planar Semiconductor THz Antennas Using Spoof Plasmons for Surface Sensing. In IEEE MTT-S International Microwave Symposium Digest (pp. 236-239). Philadelphia, PA, US: Institute of Electrical and Electronics Engineers Inc..

MLA:

Bettenhausen, Maximilian, et al. "Planar Semiconductor THz Antennas Using Spoof Plasmons for Surface Sensing." Proceedings of the 2018 IEEE/MTT-S International Microwave Symposium, IMS 2018, Philadelphia, PA Institute of Electrical and Electronics Engineers Inc., 2018. 236-239.

BibTeX: Download