Quantifying the Gain of Multi-Connectivity in Wireless LAN

Schwarzenberg N, Wolf A, Franchi N, Fettweis G (2018)


Publication Type: Conference contribution

Publication year: 2018

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 16-20

Conference Proceedings Title: 2018 European Conference on Networks and Communications, EuCNC 2018

Event location: Ljubljana SI

ISBN: 9781538614785

DOI: 10.1109/EuCNC.2018.8442457

Abstract

Multi-Connectivity (MC) using multi-link diversity is a promising approach to enable Ultra-Reliable Low-Latency Communications. While recent analytical results about MC already indicate improved reliability compared to a single link, we are interested in the actual gain of implementing MC into an established wireless standard. Therefore, we evaluate inter-frequency MC over independent fading channels for the physical layer of Wireless LAN (WLAN). We compare three combining schemes, namely Selection Combining (SC), Maximal Ratio Combining (MRC), and the recently emerging Joint Decoding (JD), by their respective packet error rates in Monte-Carlo simulations. Our results show that MC outperforms a single link for all of the three combining schemes, even if the total transmit power is not increased but shared among the available links. JD performs best and is found to be considerably less dependent on SNR estimation than MRC and SC. We show that packet synchronization in WLAN causes an error floor in frequency-selective channels which can be effectively mitigated by MC.

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How to cite

APA:

Schwarzenberg, N., Wolf, A., Franchi, N., & Fettweis, G. (2018). Quantifying the Gain of Multi-Connectivity in Wireless LAN. In 2018 European Conference on Networks and Communications, EuCNC 2018 (pp. 16-20). Ljubljana, SI: Institute of Electrical and Electronics Engineers Inc..

MLA:

Schwarzenberg, Nick, et al. "Quantifying the Gain of Multi-Connectivity in Wireless LAN." Proceedings of the 2018 European Conference on Networks and Communications, EuCNC 2018, Ljubljana Institute of Electrical and Electronics Engineers Inc., 2018. 16-20.

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