Parasitic Effects in Broadband Chip Modules Based on Multilayer LTCC Technology

Nisznansky M, Ziegler C, Schür J, Schmidt LP, Hocke R, Wohlgemuth O (2003)

Publication Language: English

Publication Type: Conference contribution, Conference Contribution

Publication year: 2003

Conference Proceedings Title: Proceedings of the 33rd European Microwave Conference

Event location: München

Abstract

In this paper we refer to typical parasitic and spurious effects that must be considered for the design of broadband modules. We focus on the discussion of problems like resonances and parasitic propagation modes which are typical for interconnects realized in a multilayer LTCC environment. For understanding such effects, full wave electromagnetic analysis of frequently used interconnects was performed. Then appropriate design measures were taken to avoid these undesirable effects. Further optimization steps on interconnects are described which minimize distortion of high speed digital signals. Resulting optimized interconnect structures can then be used as standard solution with guaranteed electrical performance for particular LTCC processes. Major part of the presented results were verified by measurements.

Authors with CRIS profile

Jan Steffen Schür Lehrstuhl für Hochfrequenztechnik Lorenz-Peter Schmidt Lehrstuhl für Hochfrequenztechnik

Involved external institutions

Alcatel-Lucent Deutschland AG DE Germany (DE)

How to cite

APA:

Nisznansky, M., Ziegler, C., Schür, J., Schmidt, L.-P., Hocke, R., & Wohlgemuth, O. (2003). Parasitic Effects in Broadband Chip Modules Based on Multilayer LTCC Technology. In Proceedings of the 33rd European Microwave Conference. München.

MLA:

Nisznansky, Martin, et al. "Parasitic Effects in Broadband Chip Modules Based on Multilayer LTCC Technology." Proceedings of the 33rd European Microwave Conference, München 2003.

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