Dense reverberation with delay feedback matrices

Schlecht S, Habets E (2019)

Publication Type: Conference contribution

Publication year: 2019

Publisher: Institute of Electrical and Electronics Engineers Inc.

Book Volume: 2019-October

Pages Range: 150-154

Conference Proceedings Title: IEEE Workshop on Applications of Signal Processing to Audio and Acoustics

Event location: New Paltz, NY US

ISBN: 9781728111230

DOI: 10.1109/WASPAA.2019.8937284

Abstract

Feedback delay networks (FDNs) belong to a general class of recursive filters which are widely used in artificial reverberation and decorrelation applications. One central challenge in the design of FDNs is the generation of sufficient echo density in the impulse response without compromising the computational efficiency. In a previous contribution, we have demonstrated that the echo density of an FDN grows polynomially over time, and that the growth depends on the number and lengths of the delays. In this work, we introduce so-called delay feedback matrices (DFMs) where each matrix entry is a scalar gain and a delay. While the computational complexity of DFMs is similar to a scalar-only feedback matrix, we show that the echo density grows significantly faster over time, however, at the cost of non-uniform modal decays.

Authors with CRIS profile

Sebastian Schlecht Professur für wahrnehmungsbasierte räumliche Audiosignalverarbeitung (AudioLabs) (Stiftungsprofessur) Emanuël Habets Professur für wahrnehmungsbasierte räumliche Audiosignalverarbeitung (AudioLabs) (Stiftungsprofessur)

How to cite

APA:

Schlecht, S., & Habets, E. (2019). Dense reverberation with delay feedback matrices. In IEEE Workshop on Applications of Signal Processing to Audio and Acoustics (pp. 150-154). New Paltz, NY, US: Institute of Electrical and Electronics Engineers Inc..

MLA:

Schlecht, Sebastian, and Emanuël Habets. "Dense reverberation with delay feedback matrices." Proceedings of the 2019 IEEE Workshop on Applications of Signal Processing to Audio and Acoustics, WASPAA 2019, New Paltz, NY Institute of Electrical and Electronics Engineers Inc., 2019. 150-154.

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