A new development of micro-copper sinter material for high power electronics application
Schwarzer C, Chew LM, Stoll T, Franke J, Kaloudis M (2020)
Publication Type: Conference contribution
Publication year: 2020
Publisher: VDE Verlag GmbH
Pages Range: 596-601
Conference Proceedings Title: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems
Event location: Berlin
ISBN: 9783800752263
Abstract
Copper is touted as an alternative die attach material. This study investigates the main parameters of a pressure sintering process using micro-scale copper sinter material as well as the behavior of the interconnection during thermal cycling by measuring the die shear strength and evaluating the microstructure of sintered copper layer. It was found that at 300°C a sintered joint is formed within 2 min. Furthermore, thermal cycling in a liquid-to-liquid shock test showed that only a slight decreased in the measured bonding strength decreased within the first 2000 cycles, therefore, the test has been extended by a further 1000 cycles.
Authors with CRIS profile
Thomas Stoll
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Jörg Franke
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Involved external institutions
How to cite
APA:
Schwarzer, C., Chew, L.M., Stoll, T., Franke, J., & Kaloudis, M. (2020). A new development of micro-copper sinter material for high power electronics application. In CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems (pp. 596-601). Berlin, DE: VDE Verlag GmbH.
MLA:
Schwarzer, Christian, et al. "A new development of micro-copper sinter material for high power electronics application." Proceedings of the 11th International Conference on Integrated Power Electronics Systems, CIPS 2020, Berlin VDE Verlag GmbH, 2020. 596-601.
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