Integration of printed electronics with potted power electronic modules

Zimmermann V, Zörner A, Chen W, Yu Z, Jank M, Bayer C, Schletz A, März M (2020)

Publication Type: Conference contribution

Publication year: 2020

Publisher: VDE Verlag GmbH

Pages Range: 137-141

Conference Proceedings Title: CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems

Event location: Berlin DE

ISBN: 9783800752263

Abstract

Printed electronics on flexible substrates are attractive for various applications in the field of sensor technology. This work aims at investigating the integration of printed electronics in potted power-electronic modules. Silver (Ag) interdigitated structures with varying electrode dimensions were printed on polyimide and polyethylene terephthalate foil and afterwards potted with Wacker SilGel® 612. Printing ability, adhesion to potting material, and contacting were investigated. Capacitance-voltage measurements were performed to characterize the behavior of printed devices in contact with potting material. Peel tests were performed in order to gain information on the adhesion of different substrate materials to the SilGel. Further, different contacting methods were evaluated. Based on the presented results, the integration of printed electronics in potted power electronic modules is highly feasible and could allow the facile addition of monitoring devices.

Authors with CRIS profile

Alicia Zörner Lehrstuhl für Elektronische Bauelemente Zechun Yu Lehrstuhl für Elektronische Bauelemente Michael Jank Lehrstuhl für Elektronische Bauelemente Christoph Bayer Lehrstuhl für Elektronische Bauelemente Martin März Lehrstuhl für Elektronische Bauelemente

Involved external institutions

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB) DE Germany (DE)

How to cite

APA:

Zimmermann, V., Zörner, A., Chen, W., Yu, Z., Jank, M., Bayer, C.,... März, M. (2020). Integration of printed electronics with potted power electronic modules. In CIPS 2020 - 11th International Conference on Integrated Power Electronics Systems (pp. 137-141). Berlin, DE: VDE Verlag GmbH.

MLA:

Zimmermann, Victoria, et al. "Integration of printed electronics with potted power electronic modules." Proceedings of the 11th International Conference on Integrated Power Electronics Systems, CIPS 2020, Berlin VDE Verlag GmbH, 2020. 137-141.

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