High-precision assembly of electronic devices with lightweight robots through sensor-guided insertion
Metzner M, Leurer S, Handwerker A, Karlidag E, Blank A, Hefner F, Franke J (2020)
Publication Type: Conference contribution
Publication year: 2020
Journal
Publisher: Elsevier B.V.
Book Volume: 97
Pages Range: 337-341
Conference Proceedings Title: Procedia CIRP
Event location: Athens
DOI: 10.1016/j.procir.2020.05.247
Abstract
Through-hole devices still play an important role in power electronics production. Due to a high number of variants in this field, an automated placement by special machines is often not economically feasible. The resulting manual process is characterized by monotony, ergonomic strain and high labor cost. As a result, a partial automation, using lightweight robots in hybrid assembly system, yields high potential. The lower stiffness and resulting accuracy deficiency of lightweight robots compared to common industrial robots, combined with the precision requirements and inherent fragility of the devices, prohibits the deployment of such systems. In this contribution, a scalable setup and strategies for visual and force-torque guided tactile insertion of such devices is presented and evaluated. A library, based on a system for the offline-programming of such tasks, is used to decrease implementation efforts. A performance evaluation of the system on printed circuit boards with multiple different devices is conducted.
Authors with CRIS profile
Maximilian Metzner
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Engin Karlidag
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Andreas Blank
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Florian Hefner
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Jörg Franke
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
How to cite
APA:
Metzner, M., Leurer, S., Handwerker, A., Karlidag, E., Blank, A., Hefner, F., & Franke, J. (2020). High-precision assembly of electronic devices with lightweight robots through sensor-guided insertion. In Sotiris Makris (Eds.), Procedia CIRP (pp. 337-341). Athens, GR: Elsevier B.V..
MLA:
Metzner, Maximilian, et al. "High-precision assembly of electronic devices with lightweight robots through sensor-guided insertion." Proceedings of the 8th CIRP Conference of Assembly Technology and Systems, CATS 2020, Athens Ed. Sotiris Makris, Elsevier B.V., 2020. 337-341.
BibTeX: Download