Sintering of conductive inks on plastic substrates by use of microwave furnaces being suitable for largescale production processes

Hartmann L, Sabban J, Behrendt F, Tatai TM, Neermann S, Franke J, Dreyer C (2021)

Publication Type: Conference contribution

Publication year: 2021

Publisher: Institute of Electrical and Electronics Engineers Inc.

Conference Proceedings Title: 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings

ISBN: 9781728175096

DOI: 10.1109/MID50463.2021.9361626

Abstract

This work is about the application of large-scale mi-crowave furnaces being suitable for the sintering of conductive structures deposited on standard plastic parts in industrial processes. The conductive structures are consisting of carbon or silver filled conductive inks. The feasibility of microwave sintering is proved by comparing the specific resistance of structures subjected to microwave sintering with conductive paths on reference samples sintered in a convection furnace. Furthermore, optical microscopy has been employed to inspect the surface morphology of conductive paths sintered by both microwave furnace and convection furnace. It turns out that appropriate microwave sintering depends on the specific way the magnetron power is controlled in the furnace and on the temporal evolution of magnetron power during the sintering process.

Authors with CRIS profile

Simone Neermann Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS) Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik (FAPS)

Involved external institutions

Fraunhofer-Institut für Angewandte Polymerforschung (IAP) / Fraunhofer Institute for Applied Polymer Research DE Germany (DE) Technische Hochschule Wildau DE Germany (DE)

How to cite

APA:

Hartmann, L., Sabban, J., Behrendt, F., Tatai, T.M., Neermann, S., Franke, J., & Dreyer, C. (2021). Sintering of conductive inks on plastic substrates by use of microwave furnaces being suitable for largescale production processes. In 2021 14th International Congress: Molded Interconnect Devices, MID 2021 - Proceedings. Institute of Electrical and Electronics Engineers Inc..

MLA:

Hartmann, Lutz, et al. "Sintering of conductive inks on plastic substrates by use of microwave furnaces being suitable for largescale production processes." Proceedings of the 14th International Congress Molded Interconnect Devices, MID 2021 Institute of Electrical and Electronics Engineers Inc., 2021.

BibTeX: Download