Enhanced the thermal conductivity of polydimethylsiloxane via a three-dimensional hybrid boron nitride@silver nanowires thermal network filler

Huang Z, Wu W, Drummer D, Liu C, Wang Y, Wang Z (2021)


Publication Type: Journal article

Publication year: 2021

Journal

Book Volume: 13

Pages Range: 1-10

Article Number: 248

Journal Issue: 2

DOI: 10.3390/polym13020248

Abstract

In this work, polydimethylsiloxane (PDMS)-based composites with high thermal conductivity were fabricated via a three-dimensional hybrid boron nitride@silver nanowires (BN@AgNWs) filler thermal network, and their thermal conductivity was investigated. A new thermal conductive BN@AgNWs hybrid filler was prepared by an in situ growth method. Silver ions with the different concentrations were reduced, and AgNWs crystallized and grew on the surface of BN sheets. PDMS-based composites were fabricated by the BN@AgNWs hybrid filler added. SEM, XPS, and XRD were used to characterize the structure and morphology of BN@AgNWs hybrid fillers. The thermal conductivity performances of PDMS-based composites with different silver concentrates were investigated. The results showed that the thermal conductivity of PDMS-based composite filled with 20 vol% BN@15AgNWs hybrid filler is 0.914 W/(m·K), which is 5.05 times that of pure PDMS and 23% higher than the thermal conductivity of 20 vol% PDMS-based composite with BN filled. The enhanced thermal conductivity mechanism was provided based on the hybrid filler structure. This work offers a new way to design and fabricate the high thermal conductive hybrid filler for thermal management materials.

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APA:

Huang, Z., Wu, W., Drummer, D., Liu, C., Wang, Y., & Wang, Z. (2021). Enhanced the thermal conductivity of polydimethylsiloxane via a three-dimensional hybrid boron nitride@silver nanowires thermal network filler. Polymers, 13(2), 1-10. https://dx.doi.org/10.3390/polym13020248

MLA:

Huang, Zhengqiang, et al. "Enhanced the thermal conductivity of polydimethylsiloxane via a three-dimensional hybrid boron nitride@silver nanowires thermal network filler." Polymers 13.2 (2021): 1-10.

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