Reliability of silver direct bonding in thermal cycling tests
Yu Z, Zeng W, Zhao D, Zhang Z, Bayer CF, Schletz A, März M (2020)
Publication Type: Conference contribution
Publication year: 2020
Publisher: Institute of Electrical and Electronics Engineers Inc.
Conference Proceedings Title: Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020
Event location: Tonsberg, Vestfold
ISBN: 9781728162928
DOI: 10.1109/ESTC48849.2020.9229753
Abstract
Silver-Silver direct bonding has been developed as an alternative interconnection technique for 3D power integration which can form high-strength and low-resistance Ag joints under solid-state conditions. However, the reliability and failure mechanisms of these direct bonded joints have not been characterized yet. In this study, four direct bonded structures were accelerated aged with two different temperature cycling tests (TCT) in the temperature range between -55 °C and 220 °C. The thermally induced stresses in the metallization during TCT can be relieved by elastic and plastic deformation of the Ag films and the debonding at the interface. At higher temperatures above 150 °C, plastic deformation mechanisms dominate the stress relaxation. Stress-driven void migration along grain boundaries may lead to cracking and interfacial failure. Metallization with a diffusion barrier and large grain size can restrict the void formation and diffusion, therefore, provide a higher temperature capability. The results indicate that both the adhesion of the Ag metallization and the Ag-Ag direct bonding remain stable after 1000 thermal cycles.
Authors with CRIS profile
Zechun Yu
Lehrstuhl für Elektronische Bauelemente
Dawei Zhao
Lehrstuhl für Elektronische Bauelemente
Martin März
Lehrstuhl für Leistungselektronik
Related research project(s)
Involved external institutions
Osaka University
Japan (JP)
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)
Germany (DE)
Japan (JP)
Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)
Germany (DE)
How to cite
APA:
Yu, Z., Zeng, W., Zhao, D., Zhang, Z., Bayer, C.F., Schletz, A., & März, M. (2020). Reliability of silver direct bonding in thermal cycling tests. In Proceedings - 2020 IEEE 8th Electronics System-Integration Technology Conference, ESTC 2020. Tonsberg, Vestfold, NO: Institute of Electrical and Electronics Engineers Inc..
MLA:
Yu, Zechun, et al. "Reliability of silver direct bonding in thermal cycling tests." Proceedings of the 8th IEEE Electronics System-Integration Technology Conference, ESTC 2020, Tonsberg, Vestfold Institute of Electrical and Electronics Engineers Inc., 2020.
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