Enhancing the ductility of laser-welded copper-aluminum connections by using adapted filler materials
Weigl M, Albert F, Schmidt M (2011)
Publication Type: Conference contribution
Publication year: 2011
Journal
Book Volume: 12
Pages Range: 335-341
Conference Proceedings Title: Physics Procedia
DOI: 10.1016/j.phpro.2011.03.141
Abstract
Laser micro welding of direct copper-aluminum connections typically leads to the formation of intermetallic phases and an embrittlement of the metal joints. By means of adapted filler materials it is possible to reduce the brittle phases and thereby enhance the ductility of these dissimilar connections. As the element silicon features quite a well compatibility with copper and aluminum, filler materials based on Al-Si and Cu-Si alloys are used in the current research studies. In contrast to direct Cu-Al welds, the aluminum filler alloy AlSi12 effectuates a more uniform element mixture and a significantly enhanced ductility. © 2011 Published by Elsevier Ltd.
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Germany (DE)How to cite
APA:
Weigl, M., Albert, F., & Schmidt, M. (2011). Enhancing the ductility of laser-welded copper-aluminum connections by using adapted filler materials. In Physics Procedia (pp. 335-341).
MLA:
Weigl, M., F. Albert, and Michael Schmidt. "Enhancing the ductility of laser-welded copper-aluminum connections by using adapted filler materials." Proceedings of the 6th International WLT Conference on Lasers in Manufacturing, LiM 2011. 335-341.
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