Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles
Wang Y, Wu W, Drummer D, Liu C, Shen W, Tomiak F, Schneider K, Liu X, Chen Q (2020)
Publication Type: Journal article
Publication year: 2020
Journal
Book Volume: 191
Article Number: 108698
DOI: 10.1016/j.matdes.2020.108698
Abstract
To solve the heat diffusion problem in electronic packaging, a novel kind of irregularly shaped hybrid filler, boron nitride@copper (BN@Cu), was successfully assembled via reduction of Cu2+. BN@Cu hybrid fillers composed of different mass ratios between BN and Cu have been prepared and characterized. A specific BN@Cu hybrid filler (mBN:mCu = 100:2), labeled as BN@2Cu, exhibited remarkable ability in enhancing the thermal conductivity of polybenzoxazine (PBz) composites fabricated through ball milling followed by hot pressing. With 25 wt% of BN@2Cu hybrid fillers, the thermal conductivity of PBz composites reaches 1.049 W m−1 K−1. Dielectric properties, electrical conductivity, and curing behavior of the composites were also investigated. In addition, Foygel's thermal conduction model was employed to demonstrate the mechanism of BN@2Cu hybrid filler in improving thermal conductivity.
Authors with CRIS profile
Dietmar Drummer
Lehrstuhl für Kunststofftechnik
Florian Tomiak
Lehrstuhl für Kunststofftechnik
Kevin Schneider
Lehrstuhl für Kunststofftechnik
Involved external institutions
China (CN)How to cite
APA:
Wang, Y., Wu, W., Drummer, D., Liu, C., Shen, W., Tomiak, F.,... Chen, Q. (2020). Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles. Materials & Design, 191. https://dx.doi.org/10.1016/j.matdes.2020.108698
MLA:
Wang, Yi, et al. "Highly thermally conductive polybenzoxazine composites based on boron nitride flakes deposited with copper particles." Materials & Design 191 (2020).
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