Parylene Coatings in Power Electronic Modules
Diepgen A, Zimmermann V, Bayer CF, Zhou Y, Forster C, Leib J, Schletz A, Virtanen S, März M (2019)
Publication Language: English
Publication Type: Conference contribution, Conference Contribution
Publication year: 2019
Event location: Heidelberg
Abstract
Double sided cooling (DSC) of power electronic modules
enables higher power densities and lower parasitics which can be advantageous,
especially for using wide bandgap power semiconductor devices [1]. Therein, insulation
materials possessing good gap filling capabilities are needed and Parylene
coatings seem to be highly promising [2]. Parylene F-VT4 and F-AF4
coatings were studied for their suitability as insulation material in double
sided power electronic modules. Gap penetration behavior, adhesion as well as
electrical insulation were compared. For the latter two properties, the effect
of aging via temperature shock testing (TST) was studied either. For both Parylene types the gap filling capability tests
showed promising results. Partial discharge measurements before and after TST
(200 cycles) showed that the Parylene F-AF4 coated samples maintain their
insulation strength in the chosen TST conditions, whereas the Parylene F-VT4
coated do not. Cross-cut testing of the Parylene F-VT4 coated samples before
and after TST (300 cycles) resulted in no or little reduction of the adhesion
due to TST.
Authors with CRIS profile
Sannakaisa Virtanen
Professur für Werkstoffwissenschaften (Korrosion und Oberflächentechnik)
Martin März
Lehrstuhl für Leistungselektronik
Involved external institutions
How to cite
APA:
Diepgen, A., Zimmermann, V., Bayer, C.F., Zhou, Y., Forster, C., Leib, J.,... März, M. (2019). Parylene Coatings in Power Electronic Modules. In Fraunhofer IISB (Eds.), Proceedings of the 2019 ISAPP. Heidelberg, DE.
MLA:
Diepgen, Antonia, et al. "Parylene Coatings in Power Electronic Modules." Proceedings of the 2019 ISAPP, Heidelberg Ed. Fraunhofer IISB, 2019.
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