Printing Wearable Devices in 2D and 3D: An Overview on Mechanical and Electronic Digital Co-design

Tansaz S, Baronetto A, Zhang R, Derungs A, Amft O (2019)

Publication Type: Journal article

Publication year: 2019

Journal

IEEE Pervasive Computing Institute of Electrical and Electronics Engineers (IEEE)

DOI: 10.1109/MPRV.2019.2948819

Abstract

Multiprocess Additive Manufacturing (AM) offers system designers new, exciting computational tools to rapidly realise smart wearable sensing devices in two-dimensional (2D) and 3D shapes. We guide readers through the novel development and fabrication process based on a digital co-design framework and highlight AM techniques, functional materials, and assembly procedures for designing wearables as flexible and stretchable on-skin patches, e-textiles, and smart accessories for everyday use.

Authors with CRIS profile

Samira Tansaz Lehrstuhl für Digital Health Annalisa Baronetto Lehrstuhl für Digital Health Rui Zhang Lehrstuhl für Digital Health Adrian Derungs Lehrstuhl für Digital Health Oliver Amft Lehrstuhl für Digital Health

How to cite

APA:

Tansaz, S., Baronetto, A., Zhang, R., Derungs, A., & Amft, O. (2019). Printing Wearable Devices in 2D and 3D: An Overview on Mechanical and Electronic Digital Co-design. IEEE Pervasive Computing. https://dx.doi.org/10.1109/MPRV.2019.2948819

MLA:

Tansaz, Samira, et al. "Printing Wearable Devices in 2D and 3D: An Overview on Mechanical and Electronic Digital Co-design." IEEE Pervasive Computing (2019).

BibTeX: Download