Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air
Sepaintner F, Scharl A, Röhrl FX, Bogner W, Zorn S (2019)
Publication Language: English
Publication Type: Conference contribution, Conference Contribution
Publication year: 2019
Pages Range: 94-96
Event location: Bochum
URI: https://ieeexplore.ieee.org/document/8880079
DOI: 10.1109/IMWS-AMP.2019.8880079
Abstract
This paper presents a new method to produce different kinds of RF waveguides with reduced attenuation on low cost PCB substrates. First, microstrip (MS) and grounded coplanar waveguides (GCPW) are characterized by considering rough conductors in CST Microwave Studio. Next, laminate is partially removed, to increase the electromagnetic field ratio in air. Accordingly, the dielectric losses are reduced and the electrical length is decreased. These conductors are produced by using a CO 2 laserdrilling machine to remove the undesired substrate. The RF performance (DC to 100 GHz) of these waveguides is compared to transmission lines manufactured in conventional PCB technology. Finally, different kinds of simulated and produced microstrip filters are shown and fabrication tolerances are compared to those produced in standard technology.
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APA:
Sepaintner, F., Scharl, A., Röhrl, F.X., Bogner, W., & Zorn, S. (2019). Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air. In IEEE (Eds.), Proceedings of the IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) (pp. 94-96). Bochum, DE.
MLA:
Sepaintner, Felix, et al. "Simulation and Manufacturing of Low Loss PCB Structures with Additional Electromagnetic Field in Air." Proceedings of the IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP), Bochum Ed. IEEE, 2019. 94-96.
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