High temperature thermal cycling reliability of silver sintered and electroplated tin based transient liquid phase joints

Hamilton DP, Syed Khaja AH, Franke J, Mawby P (2019)

Publication Type: Conference contribution

Publication year: 2019

Publisher: VDE Verlag GmbH

Conference Proceedings Title: CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

Event location: Nuremberg DE

ISBN: 9783800741717

Abstract

The long-term reliability of a large range of candidate die attach materials for use in thermal cycled applications in SiC-based high temperature power modules up to a peak temperature of 350°C have been evaluated and tested. These include various types of silver sinter materials in film and paste forms, and transient liquid phase (TLP) joints using tin preforms and electroplated tin, bonded with and without pressure. The silver sinter joint lifetimes have ranged from 104 to 504 x 0-350°C passive thermal cycles to date and all TLP joints have reached 504 cycles to date without shear test failures. Our silver sinter failure analysis have indicated a time and initial densification-dependent coarsening of the microstructure and aggregation of pores at the die attach interface during thermal cycling, eventually leading to a weak die attachment. Although initial TLP bonds using tin preforms gave good thermal cycling results, process issues led to unsatisfactory voiding of the TLP joints and significant fracturing between these voids after cycling. A new process also using electroplated tin instead of pre-forms has been used to produce much improved joints and work is now underway to determine their relative thermal cycling lifetimes.

Authors with CRIS profile

Aarief Hussain Syed Khaja Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Involved external institutions

University of Warwick GB United Kingdom (GB)

How to cite

APA:

Hamilton, D.P., Syed Khaja, A.H., Franke, J., & Mawby, P. (2019). High temperature thermal cycling reliability of silver sintered and electroplated tin based transient liquid phase joints. In CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems. Nuremberg, DE: VDE Verlag GmbH.

MLA:

Hamilton, Dean P., et al. "High temperature thermal cycling reliability of silver sintered and electroplated tin based transient liquid phase joints." Proceedings of the 9th International Conference on Integrated Power Electronics Systems, CIPS 2016, Nuremberg VDE Verlag GmbH, 2019.

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