Process optimization in transient liquid phase soldering (TLPS) for an efficient and economical production of high temperature power electronics

Syed Khaja AH, Franke J (2019)

Publication Type: Conference contribution

Publication year: 2019

Publisher: VDE Verlag GmbH

Conference Proceedings Title: CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems

Event location: Nuremberg DE

ISBN: 9783800741717

Abstract

The fulfilment of the goals towards the miniaturisation of devices while increasing the power densities and reducing the losses, requires reliable and cost-effective solutions for the production of power electronic modules. This is associated presently with the integration of wide-bandgap (WBG) semiconductor materials and corresponding design customization. Diffusion soldering particularly Transient Liquid Phase Soldering (TLPS) which is a proven thermally stable die-attach technology has been focused in this contribution. This paper contributes on the feasibility of TLPS as a cost-effective production strategy for high-temperature silicon and WBG power electronics. This contribution also focuses on the usage of Cu-Sn preforms as die-attach material. The optimised temperature profiles by combination of reducing and inert gases for void-free TLPS interconnect are introduced. Three phase rectifier bridge modules were constructed to check the feasibility of TLPS in serial production. The variation of intermetallic phase (IMP) formations in Cu-Sn and Cu-Sn-Ni preforms on bare and Ni-plated copper substrates, thermal treatment temperature and time are discussed. For improved handling of preforms and enhanced IMP formation, cladded Cu-Sn preforms are introduced and their characteristics are investigated. The advantages of process optimisation and its potential for flexibility and mass production are discussed.

Authors with CRIS profile

Aarief Hussain Syed Khaja Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

How to cite

APA:

Syed Khaja, A.H., & Franke, J. (2019). Process optimization in transient liquid phase soldering (TLPS) for an efficient and economical production of high temperature power electronics. In CIPS 2016 - 9th International Conference on Integrated Power Electronics Systems. Nuremberg, DE: VDE Verlag GmbH.

MLA:

Syed Khaja, Aarief Hussain, and Jörg Franke. "Process optimization in transient liquid phase soldering (TLPS) for an efficient and economical production of high temperature power electronics." Proceedings of the 9th International Conference on Integrated Power Electronics Systems, CIPS 2016, Nuremberg VDE Verlag GmbH, 2019.

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