Improving process reliability by means of detection of weld seam irregularities in copper via thermographic process monitoring

Schaumberger K, Beck M, Saffer J, Kaufmann F, Ermer J, Roth S, Schmidt M (2019)

Publication Type: Conference contribution

Publication year: 2019

Journal

Procedia Manufacturing Elsevier

Publisher: Elsevier B.V.

Book Volume: 36

Pages Range: 58-63

Conference Proceedings Title: Procedia Manufacturing

Event location: Trondheim NO

DOI: 10.1016/j.promfg.2019.08.009

Abstract

Laser beam welding plays an important role in automotive industry as it offers a number of advantages. These include contactless joining, localized energy input, thermally and mechanically durable welds and low electrical contact resistance of the bonded connections. The latter is exploited in the laser beam welding of copper contacts as used for electrical connections in e-mobility. However, copper entails a higher susceptibility to seam defects due to the metallurgical properties compared to, for example, car body materials which in many cases are processed by laser beam as well. In order to meet the high standards of the automotive industry an inline validation of the connections is essential. A suitable method is the monitoring of the welding process by means of thermography which has already proven itself for other metals and joining techniques but has not yet been investigated in detail for laser beam welding of copper. Consequently, this paper deals with the possibilities of thermographic process monitoring in laser beam welding of copper components. It examines the extent to which defects can be registered; so far pores have been detected reliably up to a minimal diameter of 0.5 mm.

Authors with CRIS profile

Kerstin Schaumberger Lehrstuhl für Photonische Technologien Judith Saffer Lehrstuhl für Photonische Technologien Florian Kaufmann Lehrstuhl für Photonische Technologien Michael Schmidt Lehrstuhl für Photonische Technologien

Involved external institutions

Bayerisches Laserzentrum gemeinnützige Forschungsgesellschaft mbH (BLZ) DE Germany (DE)

How to cite

APA:

Schaumberger, K., Beck, M., Saffer, J., Kaufmann, F., Ermer, J., Roth, S., & Schmidt, M. (2019). Improving process reliability by means of detection of weld seam irregularities in copper via thermographic process monitoring. In Odd M. Akselsen, Ivan Bunaziv (Eds.), Procedia Manufacturing (pp. 58-63). Trondheim, NO: Elsevier B.V..

MLA:

Schaumberger, Kerstin, et al. "Improving process reliability by means of detection of weld seam irregularities in copper via thermographic process monitoring." Proceedings of the 17th Nordic Laser Materials Processing Conference, NOLAMP 2019, Trondheim Ed. Odd M. Akselsen, Ivan Bunaziv, Elsevier B.V., 2019. 58-63.

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