Shape Memory Foil-Based Active Micro Damping for Portable Applications

Jacob K, Ahmadi S, Wendler F, Miyazaki S, Gueltig M, Kohl M (2019)

Publication Type: Conference contribution

Publication year: 2019

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 590-593

Conference Proceedings Title: 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII

Event location: Berlin DE

ISBN: 9781728120072

DOI: 10.1109/TRANSDUCERS.2019.8808494

Abstract

Novel damping devices are presented and characterized that make use of energy dissipation due to the one-way shape memory effect in micromachined shape memory alloy (SMA) foil actuators of 30 μm thickness and lateral dimensions a few mm. The design of SMA foil actuators consists of free-standing planar suspensions with bridge, spiral and folded beam design for load control in-plane and out-of-plane. In contrast to SMA wire-based solutions, this new approach is compatible to MEMS batch fabrication technology. Under pulsed loading, a damping capacity of up to 0.92 is achieved, which compares favorably with the best viscoelastic damping concepts.

Authors with CRIS profile

Frank Wendler Lehrstuhl für Werkstoffsimulation

Involved external institutions

Karlsruhe Institute of Technology (KIT) DE Germany (DE) memetis DE Germany (DE) University of Tsukuba / 筑波大学 JP Japan (JP)

How to cite

APA:

Jacob, K., Ahmadi, S., Wendler, F., Miyazaki, S., Gueltig, M., & Kohl, M. (2019). Shape Memory Foil-Based Active Micro Damping for Portable Applications. In 2019 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII (pp. 590-593). Berlin, DE: Institute of Electrical and Electronics Engineers Inc..

MLA:

Jacob, Kiran, et al. "Shape Memory Foil-Based Active Micro Damping for Portable Applications." Proceedings of the 20th International Conference on Solid-State Sensors, Actuators and Microsystems and Eurosensors XXXIII, TRANSDUCERS 2019 and EUROSENSORS XXXIII, Berlin Institute of Electrical and Electronics Engineers Inc., 2019. 590-593.

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