Influence of convection sintering parameters on electrical conductivity and adhesion of inkjet-printed silver nanoparticle inks on flexible substrates

Roudenko J, Schirmer J, Reichenberger M, Neermann S, Franke J (2018)

Publication Type: Conference contribution

Publication year: 2018

DOI: 10.1109/ICMID.2018.8527048

Authors with CRIS profile

Simone Neermann Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik Jörg Franke Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik

Involved external institutions

Technische Hochschule Nürnberg "Georg Simon Ohm" DE Germany (DE)

How to cite

APA:

Roudenko, J., Schirmer, J., Reichenberger, M., Neermann, S., & Franke, J. (2018). Influence of convection sintering parameters on electrical conductivity and adhesion of inkjet-printed silver nanoparticle inks on flexible substrates. In IEEE (Eds.), Proceedings of the 13th International Congress Molded Interconnect Devices (MID).

MLA:

Roudenko, Jewgeni, et al. "Influence of convection sintering parameters on electrical conductivity and adhesion of inkjet-printed silver nanoparticle inks on flexible substrates." Proceedings of the 13th International Congress Molded Interconnect Devices (MID) Ed. IEEE, 2018.

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