Laser Spot Welding and Soldering of Micro Components to 3-Dimensional Circuit Substrates

Ostendorf A, Kulik C, Zeadan M, Schmidt M, Horn M (2002)

Publication Type: Conference contribution

Publication year: 2002

Publisher: Meisenbach Verlag

Pages Range: 187-200

Conference Proceedings Title: 5th International Congress on Molded interconnect Devices (MID)

Event location: Bamberg

Authors with CRIS profile

Michael Schmidt Lehrstuhl für Photonische Technologien

Additional Organisation(s)

Institute of Manufacturing Technology

How to cite

APA:

Ostendorf, A., Kulik, C., Zeadan, M., Schmidt, M., & Horn, M. (2002). Laser Spot Welding and Soldering of Micro Components to 3-Dimensional Circuit Substrates. In Feldmann, K.; Meier, R.; Römer, M.; Zippmann, V. (Eds.), 5th International Congress on Molded interconnect Devices (MID) (pp. 187-200). Bamberg: Meisenbach Verlag.

MLA:

Ostendorf, A., et al. "Laser Spot Welding and Soldering of Micro Components to 3-Dimensional Circuit Substrates." Proceedings of the 5th International Congress on Molded interconnect Devices (MID), Bamberg Ed. Feldmann, K.; Meier, R.; Römer, M.; Zippmann, V., Meisenbach Verlag, 2002. 187-200.

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