High-precision blanking of thin copper foils using uncoated and coated monocrystalline silicon punches

Hildering S, Becsi L, Engel U, Merklein M, Mescheder U (2011)


Publication Type: Conference contribution

Publication year: 2011

Publisher: Research Publ.

Pages Range: 191-195

Conference Proceedings Title: Proc. 8th Int. Conf. Multi-Material Micro Manufacture

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APA:

Hildering, S., Becsi, L., Engel, U., Merklein, M., & Mescheder, U. (2011). High-precision blanking of thin copper foils using uncoated and coated monocrystalline silicon punches. In Kück, H.; Reinecke, H.; Dimov, S. (Eds.), Proc. 8th Int. Conf. Multi-Material Micro Manufacture (pp. 191-195). Research Publ..

MLA:

Hildering, Sven, et al. "High-precision blanking of thin copper foils using uncoated and coated monocrystalline silicon punches." Proceedings of the 8th Int. Conf. Multi-Material Micro Manufacture Ed. Kück, H.; Reinecke, H.; Dimov, S., Research Publ., 2011. 191-195.

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