Laser micro welding of copper and aluminium
Mys I, Schmidt M (2006)
Publication Type: Conference contribution
Publication year: 2006
Journal
Book Volume: 6107
Conference Proceedings Title: Laser-based Micropackaging, Proceedings of SPIE
ISBN: 0819461490
DOI: 10.1117/12.648376
Abstract
Aluminum combines comparably good thermal and electrical properties with a low price and a low material weight. These properties make aluminum a promising alternative to copper for a large number of electronic applications, especially when manufacturing high volume components. However, a main obstacle for a wide use of this material is the lack of a reliable joining process for the interconnection of copper and aluminum. The reasons for this are a large misalignment in the physical properties and even more a poor metallurgical affinity of both materials that cause high crack sensitivity and the formation of brittle intermetallic phases during fusion welding. This paper presents investigations on laser micro welding of copper and aluminum with the objective to eliminate brittle intermetallic phases in the welding structure. For these purposes a combination of spot welding, a proper beam offset and special filler material are applied. The effect of silver, nickel and tin filler materials in the form of thin foils and coatings in a thickness range 3-100 urn has been investigated. Use of silver and tin filler materials yields to a considerable improvement of the static and dynamic mechanical stability of welded joints. The analysis of the weld microstructure shows that an application even of small amounts of suitable filler materials helps to avoid critical, very brittle intermetallic phases on the interface between copper and solidified melt in the welded joints.
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Germany (DE)How to cite
APA:
Mys, I., & Schmidt, M. (2006). Laser micro welding of copper and aluminium. In SPIE (Eds.), Laser-based Micropackaging, Proceedings of SPIE.
MLA:
Mys, I., and Michael Schmidt. "Laser micro welding of copper and aluminium." Proceedings of the Laser-based Micropackaging, Proceedings of SPIE Ed. SPIE, 2006.
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