Laser Imaging of Three-Dimensional Molded Interconnect Devices.

Eßer G, Dietel C, Geisel M, Pursche L, Roth S (1997)

Publication Type: Conference contribution

Publication year: 1997

Publisher: Meisenbach

Pages Range: 795-798

Conference Proceedings Title: Proc. of Laser Assisted Net Shape Engineering LANE 97

Event location: Bamberg

Additional Organisation(s)

Institute of Manufacturing Technology

How to cite

APA:

Eßer, G., Dietel, C., Geisel, M., Pursche, L., & Roth, S. (1997). Laser Imaging of Three-Dimensional Molded Interconnect Devices. In GEIGER, M.; VOLLERTSEN, F. (Eds.), Proc. of Laser Assisted Net Shape Engineering LANE 97 (pp. 795-798). Bamberg: Meisenbach.

MLA:

Eßer, Gerd, et al. "Laser Imaging of Three-Dimensional Molded Interconnect Devices." Proceedings of the Proc. of Laser Assisted Net Shape Engineering LANE 97, Bamberg Ed. GEIGER, M.; VOLLERTSEN, F., Meisenbach, 1997. 795-798.

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