FE-Simulation of the heat transfer by defined cooling conditions during the hot stamping process

Svec T, Grüner M, Merklein M (2011)

Publication Type: Journal article

Publication year: 2011

Journal

Key Engineering Materials Trans Tech Publications

Publisher: None

Book Volume: 473

Pages Range: 699-706

ISBN: 9783037850831

DOI: 10.4028/www.scientific.net/KEM.473.699

Authors with CRIS profile

Thomas Svec Institute of Manufacturing Technology Martin Grüner Institute of Manufacturing Technology Marion Merklein Institute of Manufacturing Technology

Additional Organisation(s)

Institute of Manufacturing Technology

How to cite

APA:

Svec, T., Grüner, M., & Merklein, M. (2011). FE-Simulation of the heat transfer by defined cooling conditions during the hot stamping process. Key Engineering Materials, 473, 699-706. https://dx.doi.org/10.4028/www.scientific.net/KEM.473.699

MLA:

Svec, Thomas, Martin Grüner, and Marion Merklein. "FE-Simulation of the heat transfer by defined cooling conditions during the hot stamping process." Key Engineering Materials 473 (2011): 699-706.

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