Jäckisch M, Michalski M, Merklein M (2019)
Publication Type: Conference contribution
Publication year: 2019
Publisher: American Institute of Physics Inc.
Book Volume: 2113
Conference Proceedings Title: AIP Conference Proceedings
Event location: Vitoria-Gasteiz
ISBN: 9780735418479
DOI: 10.1063/1.5112644
Due to the rising demand for weight and volume reduction, the usage of high strength materials becomes more and more common. Regarding process forces, the application range of existing presses is limited in forming such metals. One approach to reduce the process forces considerably is superimposing the tool movement with ultrasonic vibration. Although the immediate occurring force and mean stress reduction were first discovered in 1955 by Langenecker and Blaha and are known phenomena, underlying effects of ultrasonic-based material softening remain object of current research. Prominent theories explaining the acoustic softening are stress superposition as well as surface and volume effects. By carrying out ultrasonic-assisted compression tests with 20 kHz oscillation frequency on pure copper, this study intends to determine permanently altered material characteristics. Therefore, compression testing with varying oscillation interval as well as amplitude is conducted and force-displacement-curves are analyzed. In comparison to conventional upsetting, an initial softening effect occurs after the unique presence of ultrasonic-assistance. Moreover, metallographic analyses support former findings. With regard to the examination of material flow as well as grain deformation, permanent microstructure alteration is found. In this way, temporary process-related and permanent material-induced effects are separated.
APA:
Jäckisch, M., Michalski, M., & Merklein, M. (2019). Residual effects of ultrasonic-assisted compression testing on pure copper. In Pedro Arrazola, Eneko Saenz de Argandona, Nagore Otegi, Joseba Mendiguren, Mikel Saez de Buruaga, Aitor Madariaga, Lander Galdos (Eds.), AIP Conference Proceedings. Vitoria-Gasteiz, ES: American Institute of Physics Inc..
MLA:
Jäckisch, Manuel, Markus Michalski, and Marion Merklein. "Residual effects of ultrasonic-assisted compression testing on pure copper." Proceedings of the 22nd International ESAFORM Conference on Material Forming, ESAFORM 2019, Vitoria-Gasteiz Ed. Pedro Arrazola, Eneko Saenz de Argandona, Nagore Otegi, Joseba Mendiguren, Mikel Saez de Buruaga, Aitor Madariaga, Lander Galdos, American Institute of Physics Inc., 2019.
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