Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments

Conference contribution
(Conference Contribution)


Publication Details

Author(s): Yu Z, Wang S, Letz S, Bayer CF, Häußler F, Schletz A, Suganuma K
Publication year: 2019
Conference Proceedings Title: 2019 International Conference on Electronics Packaging (ICEP)
Language: English


FAU Authors / FAU Editors

Häußler, Felix
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Letz, Sebastian
Lehrstuhl für Leistungselektronik


External institutions with authors

Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB)


How to cite

APA:
Yu, Z., Wang, S., Letz, S., Bayer, C.F., Häußler, F., Schletz, A., & Suganuma, K. (2019). Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments. In 2019 International Conference on Electronics Packaging (ICEP). Niigata, Japan, JP.

MLA:
Yu, Zechun, et al. "Optimization of Ag-Ag Direct Bonding for Wafer-Level Power Electronics Packaging via Design of Experiments." Proceedings of the 2019 International Conference on Electronics Packaging (ICEP), Niigata, Japan 2019.

BibTeX: 

Last updated on 2019-05-07 at 16:08