Measurement of shear forces during gripping tasks with a low-cost tactile sensing system

Agarwal R, Bergbreiter S (2019)


Publication Type: Conference contribution

Publication year: 2019

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 330-336

Conference Proceedings Title: RoboSoft 2019 - 2019 IEEE International Conference on Soft Robotics

Event location: Seoul KR

ISBN: 9781538692608

DOI: 10.1109/ROBOSOFT.2019.8722774

Abstract

To grasp and manipulate complex objects, robots require information about the interaction between the end effector and the object. This work describes the integration of a low-cost 3-axis tactile sensing system into two different robotic systems and the measurement of these complex interactions. The sensor itself is a small, lightweight, and compliant silicone based capacitive sensor. The soft and conformable design of the sensor allows it to be integrated within a variety of end effectors and locations on those end effectors (e.g. wrapped around a finger). To improve integration and data collection of the sensors, a custom interface board and ROS (Robot Operating System) package were developed. Sensor data has been collected from four different tasks: 1. pick and place of non-conductive and conductive objects, 2. wrist-based manipulation, 3. peeling tape, and 4. human interaction with a grasped object. In the last task, a closed loop controller is used to adjust the grip force on the grasped object while the human interacts with it.

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APA:

Agarwal, R., & Bergbreiter, S. (2019). Measurement of shear forces during gripping tasks with a low-cost tactile sensing system. In RoboSoft 2019 - 2019 IEEE International Conference on Soft Robotics (pp. 330-336). Seoul, KR: Institute of Electrical and Electronics Engineers Inc..

MLA:

Agarwal, Rishabh, and Sarah Bergbreiter. "Measurement of shear forces during gripping tasks with a low-cost tactile sensing system." Proceedings of the 2019 IEEE International Conference on Soft Robotics, RoboSoft 2019, Seoul Institute of Electrical and Electronics Engineers Inc., 2019. 330-336.

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