Influences of Manufacturing Sequences for the Application of Printed Electronics on Aircraft Interior Components

Conference contribution


Publication Details

Author(s): Ischdonat N, Dreyer C, Gräf D, Franke J, Horber J, Hedges M
Publication year: 2018
Conference Proceedings Title: 2018 13th International Congress Molded Interconnect Devices (MID)
Pages range: 1-5


FAU Authors / FAU Editors

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Gräf, Daniel
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


External institutions with authors

Fraunhofer Institute for Applied Polymer Research (IAP)
Neotech AMT GmbH


How to cite

APA:
Ischdonat, N., Dreyer, C., Gräf, D., Franke, J., Horber, J., & Hedges, M. (2018). Influences of Manufacturing Sequences for the Application of Printed Electronics on Aircraft Interior Components. In 2018 13th International Congress Molded Interconnect Devices (MID) (pp. 1-5).

MLA:
Ischdonat, Nils, et al. "Influences of Manufacturing Sequences for the Application of Printed Electronics on Aircraft Interior Components." Proceedings of the 2018 13th International Congress Molded Interconnect Devices (MID) 2018. 1-5.

BibTeX: 

Last updated on 2019-11-07 at 16:08