Processing LDS-Circuit Boards by Selective Laser Sintering

Wörz A, Wudy K, Drummer D, Heidebrecht M, Klein S (2019)


Publication Type: Journal article, Original article

Publication year: 2019

Journal

Book Volume: 34

Pages Range: 248-254

Journal Issue: 2

DOI: 10.3139/217.3670

Authors with CRIS profile

How to cite

APA:

Wörz, A., Wudy, K., Drummer, D., Heidebrecht, M., & Klein, S. (2019). Processing LDS-Circuit Boards by Selective Laser Sintering. International Polymer Processing, 34(2), 248-254. https://dx.doi.org/10.3139/217.3670

MLA:

Wörz, Andreas, et al. "Processing LDS-Circuit Boards by Selective Laser Sintering." International Polymer Processing 34.2 (2019): 248-254.

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