Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains

Hou X, Krauß S, Merle B (2019)

Publication Type: Journal article

Publication year: 2019

Journal

Scripta Materialia Elsevier

Book Volume: 165

Pages Range: 55-59

DOI: 10.1016/j.scriptamat.2019.02.019

Abstract

The strength of polycrystals is known to increase with decreasing grain size, known as Hall-Petch effect. However, this relationship fails to predict the strength of samples with a non-uniform distribution of grain sizes. In this study, we purposely designed and fabricated copper micropillars with a strongly bimodal microstructure: half volume consisted of a large number of ultrafine grains, while the other half was predominantly single-crystalline. Micropillar compression evidenced that bimodal samples are 35% stronger than their counterparts containing only ultrafine grains. This paradoxical finding highlights the greater strengthening potential of microstructure distribution engineering, compared to the traditional grain refinement strategy. (C) 2019 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

Authors with CRIS profile

Sebastian Krauß Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften) Benoit Merle Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)

Additional Organisation(s)

Interdisziplinäres Zentrum, Center for Nanoanalysis and Electron Microscopy (CENEM) Lehrstuhl für Werkstoffwissenschaften (Allgemeine Werkstoffeigenschaften)

Related research project(s)

SPP 2074 Fundamental multiscale investigations for improved calculation of the service life of solid lubricated rolling bearings April 1, 2019 - March 31, 2022

Involved external institutions

Coventry University GB United Kingdom (GB)

How to cite

APA:

Hou, X., Krauß, S., & Merle, B. (2019). Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains. Scripta Materialia, 165, 55-59. https://dx.doi.org/10.1016/j.scriptamat.2019.02.019

MLA:

Hou, Xiaodong, Sebastian Krauß, and Benoit Merle. "Additional grain boundary strengthening in length-scale architectured copper with ultrafine and coarse domains." Scripta Materialia 165 (2019): 55-59.

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