Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations

Conference contribution


Publication Details

Author(s): Hensel A, Schwarzer C, Scheetz M, Kaloudis M, Franke J
Publisher: IEEE
Publishing place: NEW YORK
Publication year: 2018
Conference Proceedings Title: 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC)
Pages range: 416-421


FAU Authors / FAU Editors

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Hensel, Alexander
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Petersen, Matthias
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


External institutions with authors

Hochschule Aschaffenburg


How to cite

APA:
Hensel, A., Schwarzer, C., Scheetz, M., Kaloudis, M., & Franke, J. (2018). Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations. In 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) (pp. 416-421). Singapore, SG: NEW YORK: IEEE.

MLA:
Hensel, Alexander, et al. "Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations." Proceedings of the 20th IEEE Electronics Packaging Technology Conference (EPTC), Singapore NEW YORK: IEEE, 2018. 416-421.

BibTeX: 

Last updated on 2019-15-04 at 09:23

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