Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations

Hensel A, Schwarzer C, Scheetz M, Kaloudis M, Franke J (2018)


Publication Type: Conference contribution

Publication year: 2018

Publisher: IEEE

City/Town: NEW YORK

Pages Range: 416-421

Conference Proceedings Title: 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC)

Event location: Singapore SG

DOI: 10.1109/eptc.2018.8654421

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How to cite

APA:

Hensel, A., Schwarzer, C., Scheetz, M., Kaloudis, M., & Franke, J. (2018). Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations. In 2018 IEEE 20TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE (EPTC) (pp. 416-421). Singapore, SG: NEW YORK: IEEE.

MLA:

Hensel, Alexander, et al. "Investigations of Silver Sintered Interconnections 3-Dimensional Ceramics with Plasma Based Additive Copper Metallizations." Proceedings of the 20th IEEE Electronics Packaging Technology Conference (EPTC), Singapore NEW YORK: IEEE, 2018. 416-421.

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