Wafer Conserving Full Range Construction Analysis for IC Fabrication and Process Development Based on FIB /Dual Beam Inline Application
Weiland R, Boit C, Dawes N, Dzieslaty A, Demm E, Ebersberger B, Frey L, Geyer S, Hirsch A, Lehrer C, Meis P, Kamolz M, Lezec H, Rettenmaier H, Tlttes W, Trefchler R, Zimmermann H (2000)
Publication Status: Published
Publication Type: Conference contribution, Conference Contribution
Publication year: 2000
Pages Range: 393-396
Conference Proceedings Title: Proceedings of the 26th International Symposium for Testing and Failure Analysis
Event location: Bellevue, WA
URI: https://www.scopus.com/record/display.uri?eid=2-s2.0-10744227841∨igin=inward
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How to cite
APA:
Weiland, R., Boit, C., Dawes, N., Dzieslaty, A., Demm, E., Ebersberger, B.,... Zimmermann, H. (2000). Wafer Conserving Full Range Construction Analysis for IC Fabrication and Process Development Based on FIB /Dual Beam Inline Application. In Proceedings of the 26th International Symposium for Testing and Failure Analysis (pp. 393-396). Bellevue, WA, US.
MLA:
Weiland, R., et al. "Wafer Conserving Full Range Construction Analysis for IC Fabrication and Process Development Based on FIB /Dual Beam Inline Application." Proceedings of the Proceedings of the 26th International Symposium for Testing and Failure Analysis, Bellevue, WA 2000. 393-396.
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