Reliable Metal Deposition into TiO2 Nanotubes for Leakage-Free Interdigitated Electrode Structures and Use as a Memristive Electrode

Liu N, Lee K, Schmuki P (2013)

Publication Type: Journal article

Publication year: 2013

Journal

Angewandte Chemie International Edition Wiley

Book Volume: 52

Pages Range: 12381-12384

Journal Issue: 47

DOI: 10.1002/anie.201306334

Abstract

Nearly 100 % filling of TiO2 nanotubes with metals, including Ag, Cu, Au, and Pt, was achieved by defect-sealing treatment at the bottom of the nanotubes, followed by metal deposition using nuclei formation/coalescence. The resulting short-circuit-free interdigitated electrode configurations can, for example, be used to fabricate memristive electrodes.

Authors with CRIS profile

Ning Liu Lehrstuhl für Werkstoffwissenschaften (Korrosion und Oberflächentechnik) Kiyoung Lee Lehrstuhl für Werkstoffwissenschaften (Korrosion und Oberflächentechnik) Patrik Schmuki Lehrstuhl für Werkstoffwissenschaften (Korrosion und Oberflächentechnik)

Additional Organisation(s)

Exzellenz-Cluster Engineering of Advanced Materials

How to cite

APA:

Liu, N., Lee, K., & Schmuki, P. (2013). Reliable Metal Deposition into TiO2 Nanotubes for Leakage-Free Interdigitated Electrode Structures and Use as a Memristive Electrode. Angewandte Chemie International Edition, 52(47), 12381-12384. https://dx.doi.org/10.1002/anie.201306334

MLA:

Liu, Ning, Kiyoung Lee, and Patrik Schmuki. "Reliable Metal Deposition into TiO2 Nanotubes for Leakage-Free Interdigitated Electrode Structures and Use as a Memristive Electrode." Angewandte Chemie International Edition 52.47 (2013): 12381-12384.

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