Intrinsic Au-decoration on anodic TiO2 nanotubes grown from metastable Ti-Au sputtered alloys-High density co-catalyst decoration enhances the photocatalytic H-2 evolution

Hejazi S, Altomare M, Nguyen NT, Mohajernia S, Licklederer M, Schmuki P (2019)


Publication Type: Journal article

Publication year: 2019

Journal

Book Volume: 14

Pages Range: 118-125

DOI: 10.1016/j.ampt.2018.11.009

Abstract

Recent work demonstrated that intrinsic Au nanoparticle decoration of TiO2 nanotube arrays (NTs) can be achieved by electrochemical anodization of Ti-Au alloy substrates. However, for a Ti-Au cast alloy produced by melt-alloying, the Au concentration cannot exceed the solubility limit of Au in Ti of 0.2 at.% - this sets constraints on the intrinsic Au nanoparticle loading on anodic TiO2 NTs. Here we explore "metastable" Ti-Au metal substrates that are produced by Ti and Au cosputtering and we establish Au concentrations that far exceed the solubility limit in cast Ti-Au alloys. We show the use of these "metastable" Ti-Au sputtered layers for the anodic formation of TiO2 NTs with a much higher density of Au nanoparticle loading than using classic alloys. Under optimized conditions (Au nanoparticle density) photocatalytic H-2 production from such Au@TiO2 platforms provides a 15 times higher photocatalytic H-2 evolution rate than the best rates achieved with conventional alloys. (C) 2018 Elsevier Ltd. All rights reserved.

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APA:

Hejazi, S., Altomare, M., Nguyen, N.T., Mohajernia, S., Licklederer, M., & Schmuki, P. (2019). Intrinsic Au-decoration on anodic TiO2 nanotubes grown from metastable Ti-Au sputtered alloys-High density co-catalyst decoration enhances the photocatalytic H-2 evolution. Applied Materials Today, 14, 118-125. https://dx.doi.org/10.1016/j.ampt.2018.11.009

MLA:

Hejazi, Seyedsina, et al. "Intrinsic Au-decoration on anodic TiO2 nanotubes grown from metastable Ti-Au sputtered alloys-High density co-catalyst decoration enhances the photocatalytic H-2 evolution." Applied Materials Today 14 (2019): 118-125.

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