A flexible method for the preparation of thin film samples for in situ TEM characterization combining shadow-FIB milling and electron beam-assisted etching

Liebig JP, Göken M, Richter G, Mackovic M, Przybilla T, Spiecker E, Pierron ON, Merle B (2016)


Publication Status: Published

Publication Type: Journal article

Publication year: 2016

Journal

Publisher: ELSEVIER SCIENCE BV

Book Volume: 171

Pages Range: 82-88

DOI: 10.1016/j.ultramic.2016.09.004

Abstract

A new method for the preparation of freestanding thin film samples for mechanical testing in transmission electron microscopes is presented. It is based on a combination of focused ion beam.(FIB) milling and electron-beam-assisted etching with xenon difluoride (XeF2) precursor gas. The use of the FIB allows for the target preparation of microstructural defects and enables well-defined sample geometries which can be easily adapted in order to meet the requirements of various testing setups. In contrast to existing FIB-based preparation approaches, the area of interest is never exposed to ion beam irradiation which preserves a pristine microstructure. The method can be applied to a wide range of thin film material systems compatible with XeF2 etching. Its feasibility is demonstrated for gold and alloyed copper thin films and its practical application is discussed. (C) 2016 Elsevier B.V. All rights reserved.

Authors with CRIS profile

Additional Organisation(s)

Related research project(s)

Involved external institutions

How to cite

APA:

Liebig, J.P., Göken, M., Richter, G., Mackovic, M., Przybilla, T., Spiecker, E.,... Merle, B. (2016). A flexible method for the preparation of thin film samples for in situ TEM characterization combining shadow-FIB milling and electron beam-assisted etching. Ultramicroscopy, 171, 82-88. https://dx.doi.org/10.1016/j.ultramic.2016.09.004

MLA:

Liebig, Jan Philipp, et al. "A flexible method for the preparation of thin film samples for in situ TEM characterization combining shadow-FIB milling and electron beam-assisted etching." Ultramicroscopy 171 (2016): 82-88.

BibTeX: Download