Wafer Level Package Integrated Antenna Concepts for Circular Polarization

Schmidbauer P, Wojnowski M, Weigel R, Hagelauer AM (2018)

Publication Language: English

Publication Type: Conference contribution, Conference Contribution

Publication year: 2018

Pages Range: 285-287

Conference Proceedings Title: 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Event location: San Jose, CA US

DOI: 10.1109/EPEPS.2018.8534303

Abstract

We prove design concepts for embedded wafer level ball grid array package integrated circularly polarized antennas in the 57 GHz to 64 GHz ISM band. Therefore, we propose performance requirements and evaluate the properties of four different antenna-in-package layouts based on electromagnetic full-wave simulations with focus on the axial ratio characteristics.

Authors with CRIS profile

Philipp Schmidbauer Lehrstuhl für Technische Elektronik Robert Weigel Lehrstuhl für Technische Elektronik Amelie Marietta Hagelauer Lehrstuhl für Technische Elektronik

Involved external institutions

Infineon Technologies AG DE Germany (DE)

How to cite

APA:

Schmidbauer, P., Wojnowski, M., Weigel, R., & Hagelauer, A.M. (2018). Wafer Level Package Integrated Antenna Concepts for Circular Polarization. In IEEE (Eds.), 2018 IEEE 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS) (pp. 285-287). San Jose, CA, US.

MLA:

Schmidbauer, Philipp, et al. "Wafer Level Package Integrated Antenna Concepts for Circular Polarization." Proceedings of the 27th Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS), San Jose, CA Ed. IEEE, 2018. 285-287.

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