Highly Reliable Power Modules by Pressureless Sintering

Beitrag bei einer Tagung
(Konferenzbeitrag)


Details zur Publikation

Autor(en): März M, Waltrich U, Bayer C, Zötl S, Tokarski A, Zischler S, Schletz A
Herausgeber: VDE
Jahr der Veröffentlichung: 2018
ISBN: 978-3-8007-4540-1
Sprache: Englisch


Abstract

In this work a novel highly robust pressureless sintered top side
leadframe technology for extensive chip sizes over 1 cm² will be presented.
Power cycling tests demonstrate superior power cycling capability compared to conventional
wire bonded as well as pressure assisted sintered top side contacts. The assembly
process steps will be explained and differences of both sinter technologies will
be pointed out. The applied leadframe shows special perforation patterns,
enabling the required oxidation of pressureless silver sintering pastes. FEM
simulations were executed for investigating the influence of different perforations
of the leadframe on the thermo-mechanical stress on the top side sinter layer. Furthermore
the results of the power cycling tests and the failure mechanism of two
different leadframe designs in combination with both silver sintering
technologies are shown.


FAU-Autoren / FAU-Herausgeber

März, Martin Prof. Dr.
Lehrstuhl für Leistungselektronik
Waltrich, Uwe
Lehrstuhl für Leistungselektronik


Zitierweisen

APA:
März, M., Waltrich, U., Bayer, C., Zötl, S., Tokarski, A., Zischler, S., & Schletz, A. (2018). Highly Reliable Power Modules by Pressureless Sintering. In VDE (Eds.), . Stuttgart, DE.

MLA:
März, Martin, et al. "Highly Reliable Power Modules by Pressureless Sintering." Proceedings of the 2018 10th International Conference on Integrated Power Electronics Systems (CIPS), Stuttgart Ed. VDE, 2018.

BibTeX: 

Zuletzt aktualisiert 2018-06-08 um 10:23