Vias in DBC Substrates for Embedded Power Modules

Beitrag bei einer Tagung
(Konferenzbeitrag)


Details zur Publikation

Autor(en): März M, Bach HL, Yu Z, Letz S, Bayer C, Waltrich U, Schletz A
Herausgeber: VDE
Jahr der Veröffentlichung: 2018
ISBN: 978-3-8007-4540-1
Sprache: Englisch


Abstract

This paper encompasses an evaluation of five different approaches to produce electrical vias in DBC (Direct Bonded


Copper) substrates. The investigated methods of producing vias are based on laser drilling of different via layouts in the


DBC substrates. In the next step, a stencil printing, dispensing and mechanical pressing process were tested for filling


the via holes. As filling material, copper, silver pastes and copper rivets were used to enable the electrical connection.


Before the experiments, electrical simulations have been performed in order to analyse the optimal via layout in the


DBC substrates. It could be validated that at high frequency range (1 GHz), the current density distribution improves


through the increase of via pitch, via diameter and via numbers. Combined with silver paste as filling material, the


electrical characteristics of produced blind-hole vias could be improved compared to the use of copper paste and copper


rivets. In conclusion, potential application possibilities for vias in DBC substrate, like three-dimensional power


modules, multilayer DBC stacks and chip embedding concepts are discussed.


FAU-Autoren / FAU-Herausgeber

Bach, Hoang Linh
Lehrstuhl für Leistungselektronik
Letz, Sebastian
Lehrstuhl für Leistungselektronik
März, Martin Prof. Dr.
Lehrstuhl für Leistungselektronik
Waltrich, Uwe
Lehrstuhl für Leistungselektronik


Zitierweisen

APA:
März, M., Bach, H.L., Yu, Z., Letz, S., Bayer, C., Waltrich, U., & Schletz, A. (2018). Vias in DBC Substrates for Embedded Power Modules. In VDE (Eds.), . Stuttgart, DE.

MLA:
März, Martin, et al. "Vias in DBC Substrates for Embedded Power Modules." Proceedings of the 2018 10th International Conference on Integrated Power Electronics Systems (CIPS), Stuttgart Ed. VDE, 2018.

BibTeX: 

Zuletzt aktualisiert 2018-06-08 um 10:08