Chauhan V, Weigel R, Hagelauer AM (2017)
Publication Language: English
Publication Type: Conference contribution, Abstract of lecture
Publication year: 2017
Conference Proceedings Title: European Microwave Week (EuMW), Worshop on High-Q RF MEMS devices and multiphysical cross-layer circuit design
Event location: Nuremberg, Germany
The growing complexity in RF front-ends which includes carrier aggregation and growing number of frequency bands leads to the non-linearity in acoustic devices such as Surface Acoustic Wave components (SAW). In this work, 30 different versions of 1-port and 2-port single SAW resonators are created for wafer level and printed circuit board (PCB) measurements. During the fabrication process, several different wafer designs are created like "wafer before trimming", "wafer before trimming but with passivation", "wafer after trimming but without passivation", "wafer with trimming and passivation" to the study the non-linearity. Wafer measurements and simulations are performed for different metalization ratios. Similarly, the PCB measurements up to third order inter-modulation products (IMD) and harmonics are carried out using X-parameter and conventional measurement set-up at high input power. The measurements results are compared with the nonlinear P-matrix simulation model to study the dominant sources of second and third order non-linearity in SAW components. The final goal is to find which versions of 1-port and 2-port single SAW resonators has reduced non-linearity
APA:
Chauhan, V., Weigel, R., & Hagelauer, A.M. (2017). Non-linearity in Surface Acoustic Wave devices for wireless communication at 2 GHz frequency From wafer measurements to PCB simulation. Paper presentation at European Microwave Week (EuMW), Worshop on High-Q RF MEMS devices and multiphysical cross-layer circuit design, Nuremberg, Germany.
MLA:
Chauhan, Vikrant, Robert Weigel, and Amelie Marietta Hagelauer. "Non-linearity in Surface Acoustic Wave devices for wireless communication at 2 GHz frequency From wafer measurements to PCB simulation." Presented at European Microwave Week (EuMW), Worshop on High-Q RF MEMS devices and multiphysical cross-layer circuit design, Nuremberg, Germany 2017.
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