Modelling of the electrochemical etch stop with high reverse bias across pn-junctions

Szwarc R, Frey L, Weber H, Moder I, Erlbacher T, Rommel M, Bauer AJ (2015)

Publication Status: Published

Publication Type: Conference contribution, Conference Contribution

Publication year: 2015

Publisher: Institute of Electrical and Electronics Engineers Inc.

Pages Range: 445-450

Article Number: 7164437

ISBN: 9781479999309

DOI: 10.1109/ASMC.2015.7164437

Authors with CRIS profile

Robert Szwarc Lehrstuhl für Elektronische Bauelemente Lothar Frey Lehrstuhl für Elektronische Bauelemente

Involved external institutions

Infineon Technologies Austria AG AT Austria (AT) Fraunhofer-Institut für Integrierte Systeme und Bauelementetechnologie (IISB) DE Germany (DE)

How to cite

APA:

Szwarc, R., Frey, L., Weber, H., Moder, I., Erlbacher, T., Rommel, M., & Bauer, A.J. (2015). Modelling of the electrochemical etch stop with high reverse bias across pn-junctions. In Proceedings of the 26th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2015 (pp. 445-450). Institute of Electrical and Electronics Engineers Inc..

MLA:

Szwarc, Robert, et al. "Modelling of the electrochemical etch stop with high reverse bias across pn-junctions." Proceedings of the 26th Annual SEMI Advanced Semiconductor Manufacturing Conference, ASMC 2015 Institute of Electrical and Electronics Engineers Inc., 2015. 445-450.

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