Gruenler S, Rattmann G, Erlbacher T, Bauer AJ, Frey L (2016)
Publication Status: Published
Publication Type: Journal article, Original article
Publication year: 2016
Publisher: Elsevier B.V.
Book Volume: 156
Pages Range: 19-23
DOI: 10.1016/j.mee.2016.02.008
APA:
Gruenler, S., Rattmann, G., Erlbacher, T., Bauer, A.J., & Frey, L. (2016). Monolithic 3D TSV-based high-voltage, high-temperature capacitors. Microelectronic Engineering, 156, 19-23. https://dx.doi.org/10.1016/j.mee.2016.02.008
MLA:
Gruenler, Saeideh, et al. "Monolithic 3D TSV-based high-voltage, high-temperature capacitors." Microelectronic Engineering 156 (2016): 19-23.
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