Vossiek M (2017)
Publication Language: English
Publication Type: Conference contribution
Publication year: 2017
Conference Proceedings Title: IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems
Event location: Tel Aviv, IL
DOI: 10.1109/comcas.2017.8244733
Today, electronics are implemented on rigid substrates. However, many objects in daily-life are not rigid - they are bendable, stretchable and even foldable. Examples are paper, tapes, our body, our skin and textiles. Until today there is a big gap between electronics and bendable daily-life items. Concerning this matter, the DFG Priority Program FFlexCom aims at paving the way for a novel research area: Wireless communication systems fully integrated on an ultra-thin, bendable and flexible piece of plastic or paper. The Program encompasses 13 projects led by 25 professors. By flexibility we refer to mechanical flexibility, which can come in flavors of bendability, foldability and, stretchability. In the last years the speed of flexible devices has massively been improved. However, to enable functional flexible systems and operation frequencies up to the sub-GHz range, the speed of flexible devices must still be increased by several orders of magnitude requiring novel system and circuit architectures, component concepts, technologies and materials.
APA:
Vossiek, M. (2017). Program FFlexCom — High frequency flexible bendable electronics for wireless communication systems. In IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems. Tel Aviv, IL.
MLA:
Vossiek, Martin. "Program FFlexCom — High frequency flexible bendable electronics for wireless communication systems." Proceedings of the IEEE International Conference on Microwaves, Communications, Antennas and Electronic Systems, Tel Aviv, IL 2017.
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