Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers

Beitrag in einer Fachzeitschrift


Details zur Publikation

Autorinnen und Autoren: Kästle C, Syed Khaja AH, Franke J
Zeitschrift: Journal of Microelectronics and Electronic Packaging
Jahr der Veröffentlichung: 2017
Band: 14
Heftnummer: 2
Seitenbereich: 63 - 69
ISSN: 1551-4897
eISSN: 1555-8037
Sprache: Englisch


Abstract


Additive manufacturing (AM) provides tool-free and direct manufacturing of complex geometries simultaneously integrating various functions into components. Though AM techniques are widely used in various sectors, the application into electronics production has not yet been explored. In electronics production, substrate development has high relevance due to their multifunctionality through electrically connecting components and providing mechanical support. This contribution introduces an innovative approach based on selective laser melting (SLM) in the development of high-temperature substrates through additive layered manufacturing. Furthermore, possibilities and challenges that come along with the process combination of SLM and heavy wire bonding are investigated. Wire bonding capability is analyzed on untreated as well as on postprocessed surfaces. The influence and effectiveness of various steps of postprocessing such as cleaning, sand blasting, and grinding are analyzed. Thus, interdependencies between both manufacturing process as well as postprocessing can be revealed. The effect of surface roughness and hardness of the assembly partner are investigated as well. The primary characteristics besides the bond parameters that influence the wire bonding capability are focused in this article. The process stability and the interconnection quality are evaluated by optical nondestructive laser microscopic analysis. Destructive pull and shear tests and metallographic cross sections are performed to evaluate the adhesion characteristics. By a profound understanding of all interdependencies between the two processes, a flexible manufacturing technology for power devices can be established.



FAU-Autorinnen und Autoren / FAU-Herausgeberinnen und Herausgeber

Franke, Jörg Prof. Dr.-Ing.
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Kästle, Christopher
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik
Syed Khaja, Aarief Hussain
Lehrstuhl für Fertigungsautomatisierung und Produktionssystematik


Zitierweisen

APA:
Kästle, C., Syed Khaja, A.H., & Franke, J. (2017). Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers. Journal of Microelectronics and Electronic Packaging, 14(2), 63 - 69. https://dx.doi.org/10.4071/imaps.453827

MLA:
Kästle, Christopher, Aarief Hussain Syed Khaja, and Jörg Franke. "Investigations on the Additive Manufacturing and Heavy Wire Bonding Capability of Selective Laser-Melted Circuit Carriers." Journal of Microelectronics and Electronic Packaging 14.2 (2017): 63 - 69.

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Zuletzt aktualisiert 2018-18-10 um 04:40